Residual Stress Contour Mapping

Author:  Lambda Research
Source:  The Shot Peener magazine, Vol 12/Issue 1, Spring 1998
Doc ID:  1998028
Year of Publication:  1998
Abstract:  
Reprinted from Diffraction Notes, a newsletter from Lambda Research (No. 19, Summer 1997) INTRODUCTION Traditional residual stress measurement by x-ray diffraction provides a single value of the residual stress in one direction at each point of measurement, similar to the results obtained from a single electrical resistance strain gage grid. In many failure analysis or process development applications, the direction and location of the maximum residual stress may be known. In these cases, traditional residual stress measurements, generally performed as a function of depth, are adequate.